Chip Industry Technical Paper Roundup: Aug. 18

Executive Briefing & Key Highlights

2D CFET scaling; PIM chiplet voltage-droop control; advanced-node layout repair; lithography defect prediction; 3D-IC failure analysis; chiplet and interposer optimization; 4H-SiC wafer slicing. The post Chip Industry Technical Paper Roundup: Aug. 18 appeared first on Semiconductor Engineering.