Samtec Puts AI’s Interconnect Bottleneck on Display at ECOC and AI Infra Summit

Executive Briefing & Key Highlights

Samtec is using two major 2026 industry events to make a clear engineering argument: faster accelerators alone will not determine the performance of next-generation artificial-intelligence infrastructure. The copper and optical links connecting chips, packages, boards, racks and data centers must scale in bandwidth, … Read More The post Samtec Puts AI’s Interconnect Bottleneck on Display at ECOC