EE Times23 September 2026
SEMICON INDIA 2026: India Starts Packaging Chips as Ecosystem Takes Shape
Original Publication
EE Times
Executive Briefing & Key Highlights
India moves five chip packaging plants into production as $13.5 billion ISM 2.0 expands manufacturing, design, and engineering capabilities. The post SEMICON INDIA 2026: India Starts Packaging Chips as Ecosystem Takes Shape appeared first on EE Times.
Topics:electronicssemiconductorindustryIndiaSemiconductor
