Sivers turns to CW DFB laser tech to reduce module sizes

Executive Briefing & Key Highlights

Integrating laser technology increases reliability while reducing the final form factor of modules. This philosophy has been embraced by Sivers Semiconductors. The company highlighted its 100mW O-band CW DFB laser […] The post Sivers turns to CW DFB laser tech to reduce module sizes appeared first on Electronics Weekly.